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Suzhou Delphi Laser Co., Ltd.
W2.2308、W4.4109
DPC陶瓷激光高速钻孔设备
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Product Category
System integration,Raw materials for material processing,Laser systems for production of organic and printed electronics, Laser systems for various applications, Laser systems for various materials,System components of laser production engineering, Material processing systems, Laser-based additive manufacturing
Applications
Consumer electronics/Embodied intelligence
Introduction
DPC陶瓷激光高速钻孔设备
Product Presentation
可加工空白基板涵盖氧化铝（Al₂O₃）、氮化铝（AlN）、氮化硅（Si₃N₄）及蓝宝石等多种陶瓷材料，同时提供 DPC 成品基板及高导热热沉基板。加工工艺支持钻孔、切割、开槽、区域蚀刻、划线及打码等多种应用，可满足不同结构设计与精密加工需求。
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