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Suzhou Delphi Laser Co., Ltd.
W2.2308、W4.4109
碳化硅晶锭激光切割打标一体机
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Product Category
System integration,Raw materials for material processing,Laser systems for production of organic and printed electronics, Laser systems for various applications, Laser systems for various materials,System components of laser production engineering, Material processing systems, Laser-based additive manufacturing
Applications
Consumer electronics/Embodied intelligence
Introduction
碳化硅晶锭激光切割打标一体机
Product Presentation
设备支持最大 50 mm 厚晶锭切割，采用全自动上下料方式，可同时处理 3 个晶锭；切割速度可达 0–1000 mm/s。在保证加工质量的同时，有效控制激光加工损耗：6 寸晶圆（360 μm）损耗为 120–180 μm，8 寸晶圆（510 μm）损耗为 180–220 μm。单片加工时间≤30 min（6 寸）及 ≤60 min（8 寸），满足高效率规模化生产需求。
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