Miscellaneous optical components,Optical transmission components, Processed components,Optical sensors,Fibers, cabling, connectors and distribution,Active optical components and subsystems, Passive optical components and subsystems

Consumer electronics/Embodied intelligence,Tool making/ Machine manufacturing/Industrial robot,Optics,Precision mechanics,Sensor technology

光通讯器件外壳通常采用可伐或钨铜作为主体，为器件提供电信号传输通道和光耦合接口，提供机械支撑和气密保护，解决芯片于外部电路互联。 我司产品包括蝶形外壳、10-800Gbps传输TOSA、ROSA外壳、Mini-Pin结构外壳等。用于封装各类光电发射、接收器件、陀螺仪、高速光强度调制器、光开关等光通讯器件，主要运用于宽带接入、传输网络、5G通讯、数据中心、光传感、光量子、光测量等领域。