Opto-electronic components,Electro-optics,Laser components,Miscellaneous optical components,Optical transmission components, Processed components,Optical sensors,Fibers, cabling, connectors and distribution,Active optical components and subsystems, Passive optical components and subsystems

Consumer electronics/Embodied intelligence,Chemical/Pharmaceutical industry/Medical technology/Biotechnology,Tool making/ Machine manufacturing/Industrial robot,Aviation/ Aerospace,Optics,Data & IT,Precision mechanics,Sensor technology

陶瓷封装类管壳主要包括陶瓷焊盘阵列外壳(CLGA)，陶瓷针栅阵列外壳(CPGA).陶瓷四边引线扁平外壳(COFP)、陶瓷扁平外壳(CFP)、陶瓷双列直插外壳(CDIP)、陶瓷小外形外壳(CSOP)、陶瓷无引线片式载体(CLCC)和陶瓷四边无引线扁平外壳(COFN)等。 产品具有封装密度高、气密性好、可靠性高等特点，用于FPGA、DSP、CPUSOC等数字集成电路、微波射频和功率器件封装。主要应用领域有军用航天、军用微电子、军用光电、精确制导、雷达等。