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Shenzhen HG Optoelectronic Packaging Technology Co.,Ltd.
N1.1440
军用外壳/结构件
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Product Category
Optical sensors,Modules,Equipment,Fibers, cabling, connectors and distribution,Active optical components and subsystems, Passive optical components and subsystems
Applications
Consumer electronics/Embodied intelligence,Tool making/ Machine manufacturing/Industrial robot,Aviation/ Aerospace,Defence industry,Precision mechanics
Introduction
金属玻璃熔封工艺,覆盖混合集成电路,电源,滤波器、功率放大器,驱动器等微电子器件外壳,广泛应用于航空、航天、特种等领域。
Product Presentation

金属玻璃熔封工艺,覆盖混合集成电路,电源,滤波器、功率放大器,驱动器等微电子器件外壳,广泛应用于航空、航天、特种等领域。

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